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ECE Department

School of Engineering & Science

Stevens Institute of Technology

Vita: S. Tewksbury
Representative Professional Society Activities
  • Fellow: IEEE

  • Member: IEEE Press Board (2001 - present)

  • Member IEEE CPMT Committee on Education, R. Tummala, Chair.

  • Member: IEEE Solid State Circuits Council (1992-1995). Representative of IEEE Computer Society and IEEE Communications Society.

  • IEEE Press Liaison to the Solid-State Circuits Council (1992 - 1999).

  • Member: Editorial Board, IEEE Trans. Superconductivity. (1992 - 1997).

  • Member: Signal Processing and Communications Electronics Technical Activities Board of IEEE Communications Society.

  • Member: IEEE CPMT Committee on Education

  • Member: Advanced Packaging Technical Activities Board of IEEE Components, Packaging, and Manufacturing Society Technologies Society.

  • Member of IEEE: IEEE Communications Society, Electron Devices Society, LEOS, Computer Society, Circuits and Systems Society, CPMT Society, Solid-State Circuits Society, and others.

  • Member: IEEE, APS, SCM, OSA, SPIE, ASEE, other professional societies

  • Council Member, Electronic Materials & Processing Division, ASM International (1992-1995).

  • Founder and editor, "Electronic Newsletter on Advanced Packaging", IEEE CPMT Society. (1991 - 1997).
Representative Program Chair and Conference Chair
  • General chair, 1997 IEEE Int. Conf. on Integrated Systems in Silicon, October, 1997, Austin, TX.

  • Program chair, 1996 IEEE Int. Conf. on Integrated Systems in Silicon, October, 1996, Austin, TX.

  • General Chair, 1995 IEEE Int. Conf. on Wafer Scale Integration, Jan 1995, San Francisco.

  • Program Chair, 1995 Research Conf. on Applications for Information Systems and Technologies in the Health Sciences, R.C. Byrd Health Sciences Center, Morgantown, WV.

  • Program Chair, 1994 IEEE Int. Conf. on Wafer Scale Integration, Jan 1994, San Francisco.

  • Co-organizer, SPIE Symposium on System Interconnections and Packaging Issues, Nov. 5-9, 1990, Boston, MA.

  • General Chair, SPIE Conference on System Issues, in SPIE Symposium on System Interconnections and Packaging Issues, Nov. 5-9, 1990, Boston, MA.

  • General Chair, : 6th IEEE Int. Workshop: Microelectronics and Photonics in Communications, New Seabury, MA, June 7-9, 1989.

  • Program Chair,: 5th IEEE Int. Workshop: Integrated Microelectronics and Photonics in Communications, Research Triangle, NC, Oct. 21 - 23, 1987.

  • Cochairman: 1987 Princeton Workshop on Algorithm, Architecture and Technology Issues for Models of Concurrent Computation, Princeton, NJ, Sept 30 - Oct 1, 1987.
Representative Conference Program Committees
  • 1991, 1992, 1993, 2002, 2003 IEEE Conference on Defect & Fault Tolerance in VLSI.

  • IEEE LiSLO2001 Conference, Kuala Lumpur, Oct 2001.

  • 49th Electronic Components and Technology Conference, San Diego, CA, June 1-4 1999.

  • 1999 IEEE Symposium on IC/Package Design Integration (IPPI-99),  Santa Cruz, CA, Feb 11-12, 1999.

  • 1996, 1997 IEEE Conference on Innovative Systems in Silicon.

  • 1994, 1996 Annual North Atlantic Test Workshop NATW94,96.

  • 1991-1993 IEEE Workshop: Interconnections within High Speed Systems.

  •  1992, 1993, 1994, 1995 IEEE Int. Conf. Wafer Scale Integration.

  • 1994 : Conference on Emerging Optoelectronic Technologies (CEOT'94), Bangalore, India, July 18-22,, 1994.

  • 1991, 1992 Indo-US Workshop on Emerging Optoelectronic Technologies; Indo-US Workshop on Emerging Optoelectronic Technologies, (IUWEOT) (Bangalore, India, 1991, 1992).

  • 1988 Int'l Conference on Systolic Arrays, May 25-27, 1988 (San Diego).

  • 1988 IEEE Technical Session on Fault-Tolerant Integrated Systems, Durham, NH,  March 4, 1988.
Representative Other Professional Activities
  • Member, MicroLabs International, a joint Europe/US project in "Distributed Engineering Education." (1994-1997)

  • Member, EIA Division for Multichip Module (MCM) Packaging (1992-1994).

  • Council Member, Electronic Materials &Processing Division, ASM International (1992-1995).

  • Member: Editorial Board, Int'l Journal of Microelectronic Packaging, Gordon and Breach Publishers. (1998 - 2004).