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Books
- S.K. Tewksbury coeditor (with C. Pickover, IBM), Scientific Visualization, John Wiley (1993).
- S.K. Tewksbury (editor), Microelectronic System Interconnections: Performance and Modeling, IEEE Press (1993).
- S.K. Tewksbury, Wafer Level System Integration: Implementation Issues, , Kluwer Academic Press (1989).
- S.K. Tewksbury (Senior Editor), B. W. Dickenson and S. C. Schwartz (Assoc. Editors), Concurrent Computations: Algorithms, Architecture and Technology, Plenum Press, New York (1988).
- S.K. Tewksbury (Senior editor and founder), Journal of Microelectronic System Integration, Coeditors: J. Brewer, Westinghouse Research and J. Prince, U. Arizona and R.M. Lea, Brunel University: Associate Editors. Plenum Press, (1993-1995).
- S.K. Tewksbury (Founder and editor), Frontiers of Computing Systems Research, S. K. Tewksbury (Editor), Plenum Press. An edited book series (1990 - 1992). Replaced with Journal of Microelectronic System Integration above.
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Book Chapters
- S.K. Tewksbury (coauthor of update), "Electronics," chapter in New Book of Knowledge, Grolier Inc, Danbury, CT (1999).
- S.K. Tewksbury, "Architectural Fault Tolerance," chapter in IC Manufacturability: The Art of Process and Design Integration, P. Gyvez and D. Pradhan (Eds), IEEE Press (1999).
- S.K. Tewksbury, "Wafer Scale Integration," chapter in Encyclopedia of Electrical and Electronics Engineering, Prentice Hall (1999).
- S.K. Tewksbury, "Application Specific Integrated Circuits (ASICS)" chapter in The Electrical Engineering Handbook, CRC Press, R. Dorf (Ed). (1998).
- S.K. Tewksbury, "Semiconductor Materials," chapter in The Electronics Handbook, CRC Press, J. Whitaker (Ed). (1997).
- M. Hatamian, L.A. Hornak, T.E. Little and S.K. Tewksbury, "Fundamental Interconnection Issues," chapter in Electronic Materials Handbook, ASM International, pp. 2-11 (1989).
- S.K. Tewksbury, "Electronic Phenomena in MOS Devices," chapter in Low Temperature Electronics," R. Kirshman (Ed), pp 158-162, IEEE Press (1986).
- S. K. Tewksbury, L. A. Hornak and M. Hatamian, "High Tc superconductivity: potential for expanding the performance of digital systems," chapter in Progress in Superconductivity, vol. 8: World Scientific Publishing Co., C. G. Burham and R. D. Kane (Eds), 1988.
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Conference Proceedings
- S.K. Tewksbury, D. Sciuto, and G. Chapman (Eds), Innovative Systems in Silicon, IEEE Press: Piscataway (1996).
- G.C. Chapman and S.K. Tewksbury (Eds), Wafer Scale Integration, IEEE Computer Society Press (1995).
- S.K. Tewksbury and R.M. Lea (Eds), Wafer Scale Integration, IEEE Computer Society Press (1994).
- S.K. Tewksbury and J. Carruthers (Eds), Advances in Interconnections and Packaging: System Integration and Process Integration, SPIE Proceedings, vol. 1390 (1991).
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Journal Special Issues
- S.K. Tewksbury (with D. Sciuto), Senior Guest Editor, IEEE Trans. VLSI Systems, special section (1997).
- S.K. Tewksbury (with G. Chapman and D. Sciuto) Senior Guest Editor, IEEE Trans. CPMT, special section (1997).
- S.K. Tewksbury (with G. Chapman, J. Brewer, and E. Swartzlander), Senior Guest Editor, IEEE Trans. VLSI Systems, special section (December, 1996).
- S.K. Tewksbury (with G. Chapman and J. Brewer), Guest Editor, IEEE Trans. Components, Packaging, and Hybrid Technologies, special section (Sept. 1995).
- S.K. Tewksbury, Guest editor (with Brewer, Lea, Horiguchi), IEEE Trans. Components, Packaging, and Hybrid Technology, special section (Sept. 1994).
- S..K.Tewksbury (Senior editor) and J. B. O'Neal, D. D. Falconer and J. B. Terry (Associate editors), Microelectronics and Photonics in Communications, special issue of IEEE Journal on Selected Areas in Communications, (Oct. 1990).
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