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School of Engineering & Science

Stevens Institute of Technology
Vita: S. Tewksbury
Refereed Conference Papers
  • S.K. Tewksbury, "Optoelectronics for Communications," Invited Tutorial, MRS Spring Meeting, San Francisco, 2002.

  • S.K. Tewksbury, "Challenges facing practical defect and fault tolerance for MEMS," Proc. IEEE 2001 International Symposium on Defect and Fault Tolerance in VLSI Systems, San Francisco, Oct 24-26, 2001.

  • S.K. Tewksbury and K. Devabattini, "Towards undergraduate education in systems hardware technologies," ASME/IEEE InterPACK'99 Conference, Maui, Hawaii, June 13-19 (1999).

  • S.K. Tewksbury, V. Gandakota, K. Devabattini, and P. Adabala, "Integrated memory/network architectures for cluster-organized, parallel DSP architectures,"  IEEE Symp. on IC/Package Design Integration, Santa Cruz, CA (1998).

  • S.K. Tewksbury, K. Devabattini, and V. Gandikota," A parallel DSP testbed with a heterogeneous and reconfigurable network fabric," IEEE Conf. Integrated Systems in Silicon (1997).

  • S.K. Tewksbury and L.A. Hornak, "Optical interconnects for emerging high performance electronic modules," in Proc. 1996 Advanced Technology Workshop, Hanscom AFB, MA. (August 6-8, 1996).

  • L. A. Hornak, S. K. Tewksbury, B. Das, and M. A. Jerabek, “ A Communication System Prototyping Laboratory for Electrical and Computer Engineering Curriculum Integration,” ASEE Conference, Division for Lab-Oriented Studies (DELOS), Milwaukee, Wisconsin (June 15-18, 1997).

  • L.A. Hornak and S.K. Tewksbury, "Optical and low-temperature environments for high-performance computing and communications," Invited paper: Proceedings ISM/IEPS Workshop on Optoelectronics (Ojai, CA, 1995).

  • L.A. Hornak, S.K. Tewksbury, J.C. Barr, W.D. Cox and K.S. Brown, "Optical interconnections and cryoelectronics: Complimentary enabling technologies for emerging mainstream systems?," SPIE Photonics West Symposium, Optical Interconnections III Conference (San Jose, CA, Feb 1995).

  • S.K. Tewksbury and L.A. Hornak, "Active mini-MCM daughterboard for optical interconnect insertion into microelectronic systems," Proc. 44th Electronic Components and Technology Conference (Washington, DC - May 1-4, 1994).

  • I. Petrova, M. Uppuluri, S.K. Tewksbury, and L.A. Hornak, "Silicon wafer-area network: Intelligent communications fabric for parallel computing," Proc. 1994 IEEE Int. Conf. Wafer Scale Integration," (San Francisco, January 1994).

  • L. A. Hornak, S. K. Tewksbury, "Generic VLSI platform for system-level optical interconnection insertion,"  SPIE-OE/LASE Annual Meeting (Los Angeles, CA  January 22-29 1994).

  • L. A. Hornak, S. K. Tewksbury, "A system-level VLSI platform for optical interconnection insertion," IEEE LEOS Annual Meeting (San Jose, CA  Nov 16-18 1993).

  • S. K. Tewksbury, L. A. Hornak and H. E. Nariman, "Co-integration of optoelectronics and submicron CMOS,"  IEEE Conference on Wafer Scale Integration (San Francisco, CA January 20-22, 1993).

  • L. A. Hornak, S. K. Tewksbury and H. E. Nariman, GaAs Heteroepitaxy with submicron silicon CMOS: An experimental compatibility study, SPIE OE/LASE 1849-10 (Los Angeles, CA January 18-20 1993).

  • L. A . Hornak and S. K. Tewksbury, "Optical Interconnection Insertion within Si Microelectronic Systems," invited, ASM Electronic Materials and Processes Conference (San Jose, CA August 30 -Sept 1, 1993).

  • K. W. Goossen, J. A. Walker, J. E. Cunningham, W. Y. Jan, D. A. B. Miller, S. K. Tewksbury and L. A. Hornak, “Monolithic integration of GaAs/AlGaAs multiple quantum well modulators and micron linewidth silicon MOS transistors,” in Conference on Lasers and ElectroOptics (CLEO) 1993.

  • K. W. Goossen, J. A. Walker, J. E. Cunningham, W. Y. Jan, D. A. B. Miller, S. K. Tewksbury and L. A. Hornak, "Monolithic integration of GaAs/AlGaAs multiple quantum well modulators and silicon MOS transistors," Technical Digest Optical Society of America Topical Meeting on Optical Computing, 50-53 (Palm Springs, CA March 1993).

  • L. A. Hornak, S. K. Tewksbury and H. E. Nariman, "GaAs heteroepitaxy with submicron silicon CMOS: An experimental compatibility study," SPIE OE/LASE (Los Angeles, CA January 18-20 1993).

  • S. K. Tewksbury, M. Uppuluri and L. A. Hornak, "Interconnections/micro-networks for integrated microelectronics," IEEE GLOBECOM Conference, 180-186 (Orlando, FL December 6-9, 1992).

  • S.K. Tewksbury and L.A. Hornak, "The legacy of WSI research in MCM test/repair strategies," Proc. IEEE Int. Conference on Wafer Scale Integration (Jan 22-24, 1992).

  • L. A. Hornak, S. K. Tewksbury and H. E. Nariman, "Merging optics and microelectronic systems: Compatibility of GaAs heteroepitaxy with submicron Si CMOS", 1992 Annual Meeting IEEE Laser and ElectroOptic Society (LEOS)  438 (Boston, MA Nov 16-19 1992).

  • L. A. Hornak, S. K. Tewksbury and T. W. Weidman, "Towards co-integration of optical interconnection networks within silicon multi-chip systems," in Proc. SPIE, OE/Aerospace-Sense (Orlando, FL April, 1992).

  • L. A. Hornak, S. K. Tewksbury, N. J. Hall,  S. Langsjoen, H. E. Nariman and T. W. Weidman, "Optical Interconnection Adaptation for emerging MCM environments," invited paper, in Proc. 7th Electronic Materials and Processing Congress, pp. 185-196  (Cambridge, MA  August 1992).

  • S. K. Tewksbury and L. A. Hornak, "Integration of electronics and optics for advanced MCM packaging," invited paper, Proc. IEEE Symp. on High Density Integration in Communications and Computer Systems. (Oct. 17-19, 1991).

  • S.K. Tewksbury and L.A. Hornak, "Silicon ULSI systems: A new communications challenge for optoelectronics," Invited talk, SPIE Conf. on Emerging Optoelectronic Technologies,  pp. 459-463 (Dec. 16-20, 1991, Bangalore, India).

  • S.K. Tewksbury, Physical boundaries of performance: the interconnection perspective," Invited tutorial, Proc. 1991 IEEE Int. Workshop on Defect and Fault Tolerance in VLSI Systems, pp. 227-246, IEEE Press, NY (Nov. 18-20, 1991).

  • S.K. Tewksbury, Wafer scale integration: Review and preview," Invited talk, Digest of Papers: 1991 Government Microcircuit Applications Conf. (GOMAC'91), pp. 41-44 (Nov. 1991).

  • S.K. Tewksbury, "WSI systolic networks: An active silicon circuit board function for ULSI-based parallel computing," Proc. IEEE Int. Wafer Scale Integration Conference, pp. 270-276 (San Francisco, CA: Jan. 29-31, 1991).

  • S.K. Tewksbury and L.A. Hornak, "Integration of electronics and optics for advanced MCM packaging," Invited talk, Proc. IEEE Symp. on High Density Integration in Communications and Computer Systems (Oct. 17-19, 1991).

  • S.K. Tewksbury, "Wafer scale systolic networks and their dynamic control," IEEE Int. Workshop: Interconnections within High-Speed Digital Systems (Sante Fe: May 22-24, 1991).

  • S. K. Tewksbury and L. A. Hornak, "Silicon wafer area networks: Cointegration of novel communication network technologies with silicon ULSI," 1990 Government Microcircuit Applications Conference (Las Vegas, Nevada, Nov. 6-8, 1990).

  • L. A. Hornak and S. K. Tewksbury, "Wafer-level interconnection network layout," Proc. of The International Congress on Optical Science and Engineering (The Hague, The Netherlands, March 12-15, 1990).

  • S. K. Tewksbury and L. A. Hornak, "Systolic networks for massively parallel scaled computers: A vehicle for demonstration of advanced technologies," International Symposium on Microelectronics - ISHM '90 (Chicago, IL, Oct. 15-17, 1990).

  • S. K. Tewksbury and L. A. Hornak, "Silicon wafer area networks: Cointegration of novel communication network technologies with silicon ULSI," 1990 Government Microcircuit Applications Conference (Las Vegas, Nevada, Nov. 6-8, 1990).

  • S. K. Tewksbury and L. A. Hornak, "Co-integration of optoelectronics and silicon ULSI for scaled, high-performance distributed computing systems," SPIE OE/LASE 90, (Los Angeles, CA: Jan 14-19, 1990).

  • S. K. Tewksbury, "Interconnections for high performance systems," Proc. Int. Conf. on Low Temperature Electronics, Berkeley, CA (April 23-26, 1990).

  • S.K. Tewksbury and L.A. Hornak, "System performance limits of optical interconnections," GE-CR&D Electro-Optics Workshop, Schenectady, NY (Jan. 10, 1990).

  • L. A. Hornak and S. K. Tewksbury, "Advanced interconnection technologies and system-level communication functions," Proc. 1989 IEEE V-MIC, 211-25 (Santa Clara, CA, June 12-13, 1989).

  • S. K. Tewksbury and L. A. Hornak, "System level performance limits and optical interconnect performance," Proc. IEEE LEOS '89 Annual Conference (Orlando, FL: Oct. 17-20, 1989).

  • S. K. Tewksbury, L. A. Hornak and M. Hatamian, "Semiconductor devices and superconducting interconnections at 77K: Super-semi or semi-super," Proc. IEEE Workshop on Low Temperature Semiconductor Electronics, pp. 14-18 (U. Vermont, Aug 7-8, 1989).

  • L. A. Hornak, S. K. Tewksbury and M. Hatamian, "Interconnection issues and high-Tc superconductivity," Invited talk, HiTCST 1 Symp., Electrochemical Society (Chicago, IL Oct. 11, 1988).

  • S. K. Tewksbury and L. A. Hornak, "System level performance limits and optical interconnect performance," Proc. IEEE LEOS '89 Annual Conference (Orlando, FL: Oct. 17-20, 1989).

  • S. K. Tewksbury and L. A. Hornak, "Optical vs electrical tradeoffs for communications in highly parallel, distributed memory multiprocessors," Proc. SPIE Optoelectronic & Fiber Optics Devices and Applications Conference: Optical Interconnects in the Computer Environment, vol. 1178, pp. 131-145 (Boston, MA: Sept 5-8, 1989).

  • S. K. Tewksbury, L. A. Hornak and M. Hatamian, "Semiconductor devices and superconducting vs optical interconnections," Device Research Conf. (June 19-21 1989). Extended abstract: IEEE Trans. Electron Devices.

  • L. A. Hornak, S. K. Tewksbury, T. W. Weidman and E. W. Kwock, "Advanced interconnection technologies and system-level communications functions," Proc. 6th Int. IEEE VLSI Multilevel Interconnection Conference (V-MIC), pp. 211-225 (Santa Clara, CA: June 12-13, 1989).

  • L. A. Hornak, M. Hatamian, S. K. Tewksbury, E. G. Burkhardt, R. E. Howard, P. M. Mankiewich, B. L. Straughn and C. D. Brandle, "Experiments with a 31-cm high-Tc superconducting thin film transmission line," Proc. 1989 IEEE MTT-S International Microwave Symp., vol. 2, pp. 623-626 (Long Beach, CA: June 13-15, 1989).

  • L.A. Hornak, S.K. Tewksbury and M. Hatamian, "Practical barrier issues facing high temperature interconnections in electronic systems," HiTEST 2 Symposium, Electrochemical Society (Los Angeles, CA: May 7-12, 1989).

  • S.K. Tewksbury, L.A. Hornak and M. Hatamian, "Superconducting interconnections: performance and applications," Electro/89 (New York, NY: April 11, 1989).

  • M. Hatamian, L. A. Hornak and S. K. Tewksbury, "Potential applications of high-Tc superconducting transmission lines in integrated systems," Proc. IEEE ICCD '88, pp. 172-177 (Oct. 1988).

  • L. A. Hornak, S. K. Tewksbury and M. Hatamian, "The impact of high-Tc superconductivity on system communications," Proc. 38th Electronics Comp. Conf., pp. 152-158, Los Angeles, CA, May 9-11 (1988).

  • P. Franzon and S. K. Tewksbury, "Chip-frame scheme for reconfigurable mesh-connected arrays, in Wafer Scale Integration II,"  Proc.IFIP Workshop on Wafer Scale Integration, Brunel, Sept. 23-25, 1987), R. M. Lea (ed), North-Holland Press (1988).

  • L. A. Hornak and S. K. Tewksbury, "Optical interconnections for wafer-scale architectures," Proc. 7th Ann. Int. Electronics Packaging Conf., pp. 815-819, Boston, MA, Nov 9-11 (1987).

  • S. K. Tewksbury, L. A. Hornak and M. Hatamian, "Applications and performance questions for high-Tc  superconducting films in digital electronics," Proc. Superconductors in Electronics Commercialization Workshop, San Francisco, Sept. 14-15, 1987.

  • L. A. Hornak, S. K. Tewksbury,  M. Hatamian, A. Ligtenberg, B. Sugla and P. Franzon, "Through-wafer optical interconnects for multi-wafer integrated architectures," Proc. SPIE 30th Symp. Optical and Optoelectronic Applied Sciences and Eng., San Diego, Aug 17-22 (1986).

  • D. D. Falconer, V. Lawrence and S. K. Tewksbury, "Processor-hardware considerations for adaptive digital filter algorithms," Proc. Int. Conf. Communications (1980).

  • G. L. Baldwin, N. Linde, S. K. Tewksbury, V. D. Archer and C-Y Kao, "A 42 Mbit/sec partially asynchronous code converter for digital signal processing in telephony," 1980 ISSCC Digest of Technical Papers (1980).

  • S. K. Tewksbury, "The internal structure of an LSI digital signal processor implied by a systematic decomposition of algorithms," 1978 IEEE SSC&T Workshop (1978).

  • S. K. Tewksbury, "A/D converter for digital filters," Proc. 1976 Int. Symp. Circuits and Systems (1976).
  • R. B. Kieburtz and S. K. Tewksbury, "Experimental test of a digital A-type channel bank," Proc. 1973 Int. Conf. Communications (1973).

  • S. L. Freeny, R. B. Kieburtz, K. V. Mina and S. K. Tewksbury,  "An exploratory terminal for translating between analog frequency division and digital time division signals," Proc. 1971 Int. Conf. Communications (1971).